fbpx

Econais Releases Ultra Low Power TCP/IP and Application Ready Wi-Fi module

Patras, 02.11.2011: Econais a leader in development of wireless modules, today announced their new line of ultra low power, TCP/IP and application ready Wi-Fi modules, under the family name WiSmart-32. All the parts of the family have the same small size 20mm x 27mm and come with on board antenna while they integrate power and clock management units. They can be directly supplied from battery and they provide analog and digital interfaces to connect with almost any industry standard interface.

Continue Reading

Scintera Networks and Helic sign multiyear agreement

San Francisco, 03.11.2011: Helic, the technology leader in EDA solutions for high-speed IC design and Scintera Networks, a leading provider of mixed signal semiconductors for wireless communications announce a multiyear partnership, with the integration of Helic’s VeloceRF™ and VeloceRaptor/X™ in Scintera’s RFIC design flow.

Continue Reading

Helic to present and exhibit at the 1st TSMC Open Innovation Platform Ecosystem Forum

San Francisco, 30.09.2011: Helic Inc., the technology leader in EDA solutions for high-speed IC design has been selected by TSMC, the founder and leader of the Dedicated IC Foundry segment, to present its latest technology at the TSMC 2011 Open Innovation Platform Ecosystem Forum® on October 18th, 2011 in San Jose Convention Centre, CA, USA, at 13.30-14.00 hrs.

Continue Reading

Subscribe to Newsletter

Stay informed by registering to our newsletter.